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Welcome to the official website of the Sauna thermal modeling software package. The Sauna software package can be used to simulate a wide variety of electronic components and systems, such as heat sinks (heatsinks), circuit boards (PCB's), semiconductor stackups (BGA, QFP), complete enclosures and complex duty cycle transient cooling problems.
The Sauna program is quite easy to use. Complex 3D models are created by combining the "building blocks" of circuit boards, plates, and plates with fins. Heat transfer coefficients for both convection and radiation are calculated automatically. All these powerful features are provided at a very moderate price. Sauna can be run on virtually any contemporary Windows PC. A free evaluation package is available.
To learn more about Sauna, please use the index bar on the left to view
the many informative pages contained on this site. It is suggested
that you start with Sauna
Overview. If you have a specific question that you would like
answered, contact
information is available here. | |
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![]() ![]() Thermal Solutions Inc. 3135 S. State St., Suite 108
Ann Arbor MI 48108 USAPhone: 734-761-1956 Fax: 734-761-9855 Email: GenInfo@thermalsoftware.com Sauna is a trademark of Thermal Solutions Inc. All other trademarks are the property of their respective holders.
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