Thermal Software Home
Enclosure model created with Sauna

Welcome to the official website of the Sauna™ thermal modeling software package. The Sauna software package can be used to simulate a wide variety of electronic components and systems, such as heat sinks (heatsinks), circuit boards (PCB's), semiconductor stackups (BGA, QFP), complete enclosures and complex duty cycle transient cooling problems.

contours for hybrid module

The Sauna program is quite easy to use. Complex 3D models are created by combining the "building blocks" of circuit boards, plates, and plates with fins. Heat transfer coefficients for both convection and radiation are calculated automatically. All these powerful features are provided at a very moderate price. Sauna can be run on virtually any contemporary Windows PC. A free evaluation package is available.

To learn more about Sauna, please use the index bar on the left to view the many informative pages contained on this site. It is suggested that you start with Sauna Overview. If you have a specific question that you would like answered, contact information is available here.
 

Latest News:
31 Mar 08:  Sauna V4.0 is coming soon! Sauna V4.0 will provide exciting new features for modeling thermal shutback, control systems and thermal runaway. For more details, see Sauna V4.0 Preview.
12 Oct 07: The next training session will take place on November 15 in Ann Arbor, Michigan. For further information, please see Training Sessions.
9 Mar 07: Sauna V3.90 has been released and distributed to all qualified customers. If you have not received your updated software, please contact Technical Support.
14 Sep 06: Sauna was featured in Machine Design magazine, see Sauna software review in Machine Design. Also, there are useful papers in the Papers/Articles section. "Optimum fin spacing for fan-cooled heat sinks." explains that the optimum fin spacing is primarily a function of the flow length of the heat sink. The paper also shows that expensive heat sinks with closely spaced fins can provide excellent performance, provided that the fin spacing is properly matched to the length of the heat sink. The Papers/Articles section also contains the paper "Comparing naturally cooled horizontal baseplate heat sinks with vertical baseplate heat sinks". This paper has proven to be quite popular, with hundreds of downloads each month.


Thermal Solutions Inc. 3135 S. State St., Suite 108   Ann Arbor MI 48108 USA
Phone: 734-761-1956  Fax: 734-761-9855   Email: GenInfo@thermalsoftware.com



Sauna is a trademark of Thermal Solutions Inc. All other trademarks are the property of their respective holders.


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